Dual Platform 15W UV Laser Cutting Machine for Cover film, pure glue, blue film,FR4,PP,PI,FPC, PC
UV laser cutting machine-MicroScan5000DP Introduction
Description:
Work Table:The dual-platform working mode, one in and one out, always keep the equipment in contact with uninterrupted work, greatly improve production efficiency, is a tailor-made equipment for FPC and PCB processing.
Efficient and fast FPC/PCB profile cutting, drilling and covering film windowing, fingerprintrecognition chip cutting, TF memory card sub-board, mobile phone camera module cutting and other applications.
Divided, layered, designated block or selected area is cut and formed directly, the cutting edge is neat and round, smooth, without burrs, and without glue overflow. The products can be arranged in a matrix for automatic positioning and cutting, which is especially suitable for the cutting of fine, difficult, and complex patterns.
High-performance laser: The solid-state UV laser of the international first-line brand is used. It has the advantages of good beam quality, small focus spot, uniform power distribution, small thermal effect, small slit width, and high cutting quality, which guarantees perfect cutting quality.
Fast and high precision: The combination of a high-precision, low-drift galvanometer and a fast iron-core linear motor system platform can cut quickly while maintaining micron-level precision.
Fully automatic positioning: the use of high-precision CCD automatic positioning and focusing, making positioning fast, accurate and precise, without manual intervention, simple operation, and achieve the same type of one-key mode, greatly improving production efficiency.
Exhaust gas treatment system: The suction system can eliminate all cutting exhaust gas, avoiding the harm to the operator and the pollution to the environment.
High degree of automation: the galvanometer is automatically calibrated, automatically adjusted, and the entire process is automated. The laser displacement sensor is used to automatically adjust the focus to the height of the table to achieve fast alignment, saving time and worry.
Easy-to-learn software: self-developed control software based on Windows system, easy-to-operate Chinese interface, friendly and beautiful, powerful and diverse, simple and convenient to operate.
MicroScan5000DP Specification:
| Item |
Device Model |
MicroScan 5000DP |
|
|
Laser Brand |
Optowave/United States |
| |
Laser Power |
15W |
| |
Laser Properties |
All solid-state UV laser |
| |
Laser Wavelength |
355nm |
| |
Galvanometer |
SCANLAB/CTI Germany |
| |
Field Lens |
SILL/JENOPTIK Germany |
| |
Guide |
HIWIN/Taiwan |
| |
Reflector |
United States(Optowave) |
| |
Grating Ruler |
Renishaw/United States |
| |
CCD |
MVC/Italy |
| Accessories Configuration |
Driver
|
Yaskawa / Japan
|
| |
Reflector |
Optowave/United States |
| |
Linear motor |
igus/Shanghai ECHU |
| |
355 Beam Expander |
Optowave/United States |
| |
Linear Motor |
HIWIN/Taiwan |
| |
355 Beam Expander |
United States(Optowave) |
| |
Dust Processor |
HOYAN |
| |
Equipment Body |
Marble/Qingdao |
| |
Motion control card |
Trinidad Cloud/Shenzhen, China |
| |
Cutting Software |
Hoyan-ScanCut |
| |
Spot Diameter |
20± 5um |
| |
Maximum Scanning Range of Galvanometer |
50mm*50mm |
|
Performance configuration
|
Cutting Substrate Thickness
|
Less than 1.2mm (Depending on the
cutting quality of different
materials)
|
| |
Repeatability |
±2 μm |
| |
Positioning Accuracy |
±2 μm |
| |
Machining Accuracy
|
±20 μm
|
| |
Largest Format |
350*450mm*350*450mm(2 Table) |
| |
Equipment Size |
1350mm(L)×1150mm(W)×1550mm(H) |
| |
Support document format |
Gerber/DXF |
| |
Equipment Weight |
2000KG |
| |
Way of working |
Double Table Switch |
|
Environmental Requirements
|
Power Supply |
AC220V / 3.5KW |
| |
Grid Demand |
(Two-phase) single-phase AC220V |
| |
Temperature |
20±2 ℃ |
| |
Humidity |
50-60% no condensation
|
| |
Air pressure requirement |
0.5~0.6Mpa(No need for stand-alone) |
| |
Shock |
≤5um |
Product Tags:
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Dual Platform 15W UV Laser Cutting Machine For Cover Film Images
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